SmartDV 将展示可靠可信的验证IP和调试器
Will Feature Portfolio of SmartDV Verification IP, Demonstrate Smart ViPDebug Protocol Debugger
SAN JOSE, CALIF. –– November 6, 2019 –– SmartDV™ Technologies will exhibit at SemIsrael Expo 2019 in Airport City, Israel, November 19 and ICCAD China 2019 November 21-22 in Nanjing, China.
At both events, SmartDV will showcase why it is the Proven and Trusted choice for Verification and Design Intellectual Property (IP), including new additions to its extensive and broad portfolio of protocols. SmartDV’s latest VIP supports the TileLink chip-scale interconnect standard, an open-source, high-performance and scalable cache-coherent fabric for RISC-V based system-on-chip (SoC) designs, and Verilator, the free, open-source hardware description language (HDL) simulator.
In addition, SmartDV will demonstrate its Smart ViPDebug™, a visual protocol debugger that reduces debug time by rapidly identifying violations.
SemIsrael and ICCAD China attendees can schedule meetings to discuss SmartDV’s Verification and Design IP or arrange for private demos of Smart ViPDebug at demo@smart-dv.com.
About SmartDV
SmartDV™ Technologies is the Proven and Trusted choice for Verification and Design IP with the best customer service from more than 250 experienced ASIC and SoC design and verification engineers. Its high-quality standard or custom protocol Design and Verification IP supports simulation, emulation, field programmable gate array (FPGA) prototyping, post-silicon validation, formal property verification, RISC-V verification services. The result is Proven and Trusted Design and Verification IP used in hundreds of networking, storage, automotive, bus, MIPI and display chip projects throughout the global electronics industry. SmartDV is headquartered in Bangalore, India, with U.S. headquarters in San Jose, Calif. Visit SmartDV to learn more.
Related Semiconductor IP
- Flash Memory LDPC Decoder IP Core
- SLM Signal Integrity Monitor
- All Digital Fractional-N RF Frequency Synthesizer PLL in GlobalFoundries 22FDX
- USB 4.0 V2 PHY - 4TX/2RX, TSMC N3P , North/South Poly Orientation
- TSMC CLN5FF GUCIe LP Die-to-Die PHY
Related News
- 中国是唯一在2019年实现纯晶圆代工销售增长的国家
- SmartDV 与 NSITEXE 签署合作协议,扩展NSITEXE RISC-V 32 位 CPU 内核在北美、中国、印度及台湾市场的使用
- 英国针对Imagination面向中国IP销售风险 “焦思苦虑”
- 新思科技和 Ansys 就收购完成的预计时间发布更新