How Secure DDR Interfaces Protect DRAM from Memory Attacks
Brett Murdock, Dana Neustadter (Synopsys)
Vendor:
VEGA Semiconductor
Category:
DDR
high-speed interface for high-performance DDR3 PHY
The T40LP_DDR3TOPV01 IP is a high-speed interface for high-performance DDR3 PHY applications.
Overview
The T40LP_DDR3TOPV01 IP is a high-speed interface for high-performance DDR3 PHY applications. This IP based on TSMC 40nm LP process. The operation speed is up to 800MHz (1600Mbps) at 1.5V voltage for DDR3 application. The on-die termination (ODT) is provided to improve the signal integrity (SI).
Key features
- Process: TSMC 40nm LP process
- Support DDR3 1.5v
- Various ODT values provided, Res : 20~100ohm
- Various OCD values provided
- Support internal Vref generation
- Support internal PLL
- Support wire bond and flip chip packaging
- Operated Ambient Temperature: Ta = -40 ~ 85°C
- Operated Junction Temperature: Tj = -40~125°C
Block Diagram
T40LP_DDR3TOPV01 block diagram
Silicon Options
| Foundry | Node | Process | Maturity |
|---|---|---|---|
| TSMC | 40nm | LP eFlash | Available on request |
Specifications
Identity
Part Number
T40LP_DDR3TOPV01
Vendor
VEGA Semiconductor
Type
Silicon IP
Controller / PHY
Controller + PHY
,
PHY
Provider
VEGA Semiconductor
HQ:
Taiwan
VEGA SEMICONDUCTOR Corp. is a leading fabless ASIC design company providing Analog and Mixed-Signal IP Cores.
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Frequently asked questions about DDR Interface IP
What is high-speed interface for high-performance DDR3 PHY?
high-speed interface for high-performance DDR3 PHY is a DDR IP core from VEGA Semiconductor listed on Semi IP Hub. It is listed with support for tsmc Available on request.
How should engineers evaluate this DDR?
Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this DDR IP.
Can this semiconductor IP be compared with similar products?
Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.