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In this fourth part of Paving the way for the next generation audio codec for True Wireless Stereo (TWS) applications whitepaper, the pure audio performance will be discussed.
In this third part of Paving the way for the next generation audio codec for the True Wireless Stereo (TWS) applications whitepaper, the latency performance and how it impacts the ANC performance will be detailed.
In this second part of Paving the way for the next generation audio codec for True Wireless Stereo (TWS) applications whitepaper, energy efficiency will be discussed and several means to achieve extra-long playtime will be exposed.
This article describes the main automotive application constraints that have an impact on audio performances and thus consumer experience, together with design considerations to be taken care of at silicon Intellectual Property (IP), Systemon- Chips (SoC), application firmware/software and Printed Circuit Board (PCB) levels.
The virtual validation of subsystem performances (Pop-up Noise, Signal-to-Noise Ratio, Power supply Noise, Power consumption...) requires the modeling and simulation of complete subsystems. Application Hardware Modeling (AHM) consists in addressing the risks of performance degradation while integrating a Silicon IP in its Integrated Circuit (IC) and this IC on its Printed Circuit Board (PCB). The selection of relevant models for a subsystem performance, along with the creation and validation of models through equivalence checking, are the basics of Application Hardware Modeling for right-on-first-pass subsystems!
Today’s energy metering standards demand higher accuracy and lower power consumption which, in turn, challenges system designers to deliver more competitive AFEs. This article reviews those challenges and presents a solution based on a multiplexed channel architecture that delivers ultra-high resolution, along with very low-power consumption and silicon area.
